O le lo R4900 G3 lati ṣe atilẹyin awọn iṣẹ wọnyi
- Ipilẹṣẹ - Ṣe atilẹyin ọpọlọpọ awọn iru iṣẹ ṣiṣe lori olupin kan lati ṣafipamọ aaye
- Data Nla - Ṣakoso idagbasoke ipilẹ ti iṣeto, ti ko ṣeto, ati data idasile-ologbele.
- Awọn ohun elo ti o da lori ibi ipamọ - Yọ I/O igo-igo kuro ki o mu iṣẹ ṣiṣe dara si
- Ile-ipamọ data / itupalẹ - data ibeere lori ibeere lati ṣe iranlọwọ ipinnu iṣẹ
- iṣakoso ibatan alabara (CRM) - Ṣe iranlọwọ fun ọ lati ni awọn oye okeerẹ sinu data iṣowo lati ni ilọsiwaju
onibara itelorun ati iṣootọ
- Eto awọn orisun ile-iṣẹ (ERP) - Gbẹkẹle R4900 G3 lati ṣe iranlọwọ fun ọ lati ṣakoso awọn iṣẹ ni akoko gidi
- Awọn amayederun tabili foju (VDI) - Ṣiṣe iṣẹ iṣẹ tabili latọna jijin lati mu agbara ọfiisi nla wa ati mu ṣiṣẹ
telecommuting pẹlu eyikeyi ẹrọ nibikibi nigbakugba
- Iṣiro iṣẹ-giga ati ẹkọ ti o jinlẹ - Pese awọn modulu GPU jakejado iho meji-meji 3 ni ifẹsẹtẹ 2U, ipade awọn
awọn ibeere ti ẹkọ ẹrọ ati awọn ohun elo AI
Imọ sipesifikesonu
| Iṣiro | 2 × 2nd Iran Intel Xeon Scalable Processors (CLX&CLX-R)(Titi di awọn ohun kohun 28 ati agbara agbara 205 W ti o pọju) |
| Iranti | 3.0 TB (o pọju) 24 × DDR4 DIMMs (Titi di iwọn gbigbe data 2933 MT/s ati atilẹyin ti RDIMM ati LRDIMM mejeeji) (Titi di 12 Intel ® Optane™ DC Modulu Iranti Itẹẹpẹ.(DCPMM) |
| Iṣakoso ipamọ | Adarí RAID ti a fi sinu (SATA RAID 0, 1, 5, ati 10) Awọn kaadi PCIe HBA boṣewa ati awọn oludari ibi ipamọ (Iyan) |
| FBWC | 8 GB DDR4-2133MHz |
| Ibi ipamọ | Iwaju 12LFF + ru 4LFF ati 4SFF tabi iwaju 25SFF + ru 2SFF ṣe atilẹyin SAS/SATA HDD/SSD, ṣe atilẹyin fun awọn awakọ NVMe 24 480 GB SATA M.2 SSDs (iyan) Awọn kaadi SD |
| Nẹtiwọọki | 1 × lori ọkọ 1 Gbps iṣakoso nẹtiwọọki ibudo1 × mL OM Adaparọ Ethernet ti o pese awọn ebute oko oju omi 4 × 1GE tabi 2 × 10GE Ejò/awọn ebute oko okun. 1 × PCIe Ethernet ohun ti nmu badọgba (Iyan) |
| PCIe iho | Awọn iho 10 × PCIe 3.0 (awọn iho boṣewa mẹjọ, ọkan fun oludari ibi ipamọ Mezzanine, ati ọkan fun ohun ti nmu badọgba Ethernet) |
| Awọn ibudo | Asopọmọra VGA iwaju (Iyan) Asopọ VGA ẹhin ati ibudo ni tẹlentẹle Awọn asopọ 5 × USB 3.0 (ọkan ni iwaju, meji ni ẹhin, ati meji ninu olupin) 1 × USB 2.0 asopo (aṣayan) 2 × Awọn iho MicroSD (Aṣayan) |
| GPU | 3 × meji-Iho jakejado GPU modulu tabi 4 × nikan-Iho jakejado GPU modulu |
| Wakọ opitika | Wakọ opiti ita Nikan awọn awoṣe awakọ 8SFF ṣe atilẹyin awọn awakọ opiti ti a ṣe sinu |
| Isakoso | HDM (pẹlu ibudo iṣakoso igbẹhin) ati H3C FIST |
| Aabo | Ṣe atilẹyin Iwari ifọle ẹnjini ， TPM2.0 |
| Ipese agbara & fentilesonu | Platinum 550W/800W/850W/1300W/1600W, tabi 800W –48V DC ipese agbara (1+1 apọju) Gbona swappable egeb (atilẹyin apọju) |
| Awọn ajohunše | CE, UL, FCC, VCCI, EAC, ati bẹbẹ lọ. |
| Iwọn otutu iṣẹ | 5°C si 50°C (41°F si 122°F)Iwọn otutu iṣiṣẹ ti o pọ julọ yatọ nipasẹ iṣeto ni olupin. |
| Awọn iwọn (H × W × D) | Laisi bezel aabo: 87.5 × 445.4 × 748 mm (3.44 × 17.54 × 29.45 in) Pẹlu bezel aabo: 87.5 × 445.4 × 769 mm (3.44 × 17.54 × 30.28 in) |
Ifihan ọja
